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| ZXMP10A18G 100V P-CHANNEL ENHANCEMENT MODE MOSFET SUMMARY V(BR)DSS = - 100V : RDS(on) = 0.150 DESCRIPTION This new generation of Trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. ; ID = - 3.7A FEATURES * Low on-resistance * Fast switching speed * Low threshold * Low gate drive * SOT223 package SOT223 APPLICATIONS * DC-DC Converters * Power Management functions * Relay and Solenoid driving * Motor control ORDERING INFORMATION DEVICE ZXMP10A18GTA ZXMP10A18GTC REEL SIZE 7" 13" TAPE WIDTH 12mm 12mm QUANTITY PER REEL 1,000 units 4,000 units PINOUT DEVICE MARKING * ZXMP 10A18 ISSUE 1 - MARCH 2005 1 SEMICONDUCTORS ZXMP10A18G ABSOLUTE MAXIMUM RATINGS PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ VGS=10V; TA=25C (b) @V GS=10V; TA=70C (b) @ V GS=10V; TA=25C (a) Pulsed Drain Current (c) SYMBOL V DSS V GS ID LIMIT -100 20 -3.7 -3.0 -2.6 UNIT V V A A A A A A W mW/C W mW/C C I DM IS I SM PD PD T j , T stg -16.5 -5.3 -16.5 2 16 3.9 31 -55 to +150 Continuous Source Current (Body Diode) (b) Pulsed Source Current (Body Diode) (c) Power Dissipation at T A =25C (a) Linear Derating Factor Power Dissipation at T A =25C Linear Derating Factor Operating and Storage Temperature Range (b) THERMAL RESISTANCE PARAMETER Junction to Ambient (a) SYMBOL R JA R JA VALUE 62.5 32.2 UNIT C/W C/W Junction to Ambient (b) NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For a device surface mounted on FR4 PCB measured at t 10 sec. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02 pulse width = 300 s - pulse width limited by maximum junction temperature. ISSUE 1 - MARCH 2005 SEMICONDUCTORS 2 ZXMP10A18G CHARACTERISTICS ISSUE 1 - MARCH 2005 3 SEMICONDUCTORS ZXMP10A18G ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated) PARAMETER STATIC Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Gate-Source Threshold Voltage Static Drain-Source On-State Resistance Forward Transconductance (1)(3) DYNAMIC (3) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING (2) (3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge SOURCE-DRAIN DIODE Diode Forward Voltage (1) Reverse Recovery Time (3) Reverse Recovery Charge (3) V SD t rr Q rr -0.85 49 107 -0.95 V ns nC T j =25C, I S = -3.5A, V GS =0V T j =25C, I S = -2.8A, di/dt=100A/ s t d(on) tr t d(off) tf Qg Q gs Q gd 4.6 6.8 33.9 17.9 26.9 3.9 10.2 ns ns ns ns nC nC nC V DS = -50V, V GS = -10V I D = -2.8A V DD = -50V, I D = -1A R G = 6.0 , V GS = -10V C iss C oss C rss 1055 90 76 pF pF pF V DS = -50V, V GS =0V f=1MHz (1) SYMBOL MIN. TYP. MAX. UNIT CONDITIONS V (BR)DSS I DSS I GSS V GS(th) R DS(on) g fs -100 -1 100 -2.0 -4.0 0.150 0.190 6.0 V A nA V I D = -250 A, V GS =0V V DS = -100V, V GS =0V V GS =20V, V DS =0V I D = -250 A, V DS =V GS V GS = -10V, I D = -2.8A V GS = -6V, I D = -2.4A S V DS = -15V, I D = -2.8A NOTES (1) Measured under pulsed conditions. Pulse width 300ms; duty cycle 2%. (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing. ISSUE 1 - MARCH 2005 SEMICONDUCTORS 4 ZXMP10A18G TYPICAL CHARACTERISTICS ISSUE 1 - MARCH 2005 5 SEMICONDUCTORS ZXMP10A18G TYPICAL CHARACTERISTICS ISSUE 1 - MARCH 2005 SEMICONDUCTORS 6 ZXMP10A18G PACKAGE OUTLINE PAD LAYOUT DETAILS Controlling dimensions are in millimetres. Approximate conversions are given in inches PACKAGE DIMENSIONS DIM A B C D E F Millimetres Min 6.3 3.3 0.6 2.9 0.24 Max 6.7 3.7 1.7 0.8 3.1 0.32 Inches Min 0.248 0.130 0.024 0.114 0.009 Max 0.264 0.146 0.067 0.031 0.122 0.13 DIM G H K L M Millimetres Min Max Inches Min Max NOM 4.6 0.85 0.02 6.7 1.05 0.10 7.3 NOM 0.181 0.033 0.0008 0.264 0.041 0.004 0.287 NOM 2.3 NOM 0.0905 (c) Zetex Semiconductors plc 2005 Europe Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 1 - MARCH 2005 7 SEMICONDUCTORS |
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